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HYG089R01154A

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HYG089R01154A
Production process


Specification
Code HYG089R01154A Customer PN


Layer 1 Blind/Buried Via NO

Base Material CEM1 Unit Size(mm) 312.0000 X 312.0000
Board thickness 1
 Panle Size(mm) 332.0000
 X 332.0000
Min hole 0.8
 Pcs/Panle 1 X 1
Total Holes 93/SET
 Copper OZ(finish) 2OZ Base Cu /
W/S(mil) 25 Min Hole Copper Thickness 20um

Outline Finish CNC+V-CUT Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing
 HASL Lead Free

X-out / Solder Mask White

Special request Mark
 Silkscreen White

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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